2.5D Becomes A Reality
Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at Samsung; Rob Aitken, an ARM fellow; John Shin, vice president at Marvell; Bill...
View ArticleHigh-Bandwidth Memory
High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first...
View ArticleEnd Of Mixed Signal Engineering?
EDA companies are stepping back after years of trying to force engineers to combine analog and digital disciplines. Rather than emphasizing mixed signal as a single expertise, they are building bridges...
View ArticleWhy This Roadmap Matters
The semiconductor industry is now officially looking beyond PCs and servers, establishing metrics and guidance for existing and developing market segments rather than just focusing on how to get to the...
View Article2.5D Becomes A Reality
Semiconductor Engineering sat down to discuss 2.5D and advanced packaging with Max Min, senior technical manager at Samsung; Rob Aitken, an ARM fellow; John Shin, vice president at Marvell; Bill...
View ArticlePower-Centric Chip Architectures
As traditional scaling runs out of steam, new chip architectures are emerging with power as the starting point. While this trend has been unfolding for some time, it is getting an extra boost and sense...
View ArticleNo More Straight Lines
Shrinking features on a chip is no longer the only way forward, and in an increasing number of designs and markets, it is no longer the best way forward. Power and performance are generally better...
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The Evolving Thermal Landscape
Managing heat in chips is becoming a precision balancing act at advanced nodes and with advanced packaging. While it’s important to ensure that temperatures don’t rise high enough to cause reliability...
View ArticleBridging the IP Divide
IP reuse enabled greater efficiency in the creation of large, complex SoCs, but even after 20 years there are few tools to bridge the divide between the IP provider and the IP user. The problem is that...
View ArticleOne-On-One: Dave Hemker
Dave Hemker, CTO at Lam Research, sat down with Semiconductor Engineering to look at some of the key issues on the process and manufacturing side, and some of the key developments that will reshape the...
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The Trouble With MEMS
The advent of the Internet of Things will open up a slew of new opportunities for MEMS-based sensors, but chipmakers are proceeding cautiously. There are a number of reasons for that restraint....
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Electromigration: Not Just Copper Anymore
While integrated circuit manufacturers have worried about electromigration for a long time, until recently most of their concerns have focused on the on-chip interconnects. The larger dimensions found...
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Plotting The Next Semiconductor Road Map
The semiconductor industry is retrenching around new technologies and markets as Moore’s Law becomes harder to sustain and growth rates in smart phones continue to flatten. In the past, it was a sure...
View ArticleHow To Build Systems In Package
The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on...
View ArticleThe Future Of Memory
Semiconductor Engineering sat down to discuss future memory with Frank Ferro, senior director of product management for memory and interface IP at Rambus; Marc Greenberg, director of product marketing...
View ArticlePerformance First
Crank up the clock speed. It takes a lot more performance to run virtual reality smoothly, or to process data in the cloud, or to stream a high-definition video from a drone. And none of that compares...
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Photonics Moves Closer To Chip
Silicon photonics is resurfacing after more than a decade in the shadows, driven by demands to move larger quantities of data faster, using extremely low power and with minimal heat. Until recently,...
View ArticleAdvanced Packaging Options, Issues
Systems in package are heading for the mass market in applications that demand better performance and lower power. As they do, new options for cutting costs are being developed to broaden the appeal of...
View ArticleThe Road To 5nm
There is strong likelihood that enough companies will move to 7nm to warrant the investment. How many will move forward to 5nm is far less certain. Part of the reason for this uncertainty is...
View ArticleInterconnect Challenges Rising
Chipmakers are ramping up their 14nm finFET processes, with 10nm and 7nm slated to ship possibly later this year or next. At 10nm and beyond, IC vendors are determined to scale the two main parts of...
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