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What’s Next In Scaling, Stacking
An Steegen, executive vice president of semiconductor technology and systems at Imec, sat down with Semiconductor Engineering to discuss IC scaling, chip stacking, packaging and other topics. Imec is...
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2.5D, ASICs Extend to 7nm
The leading-edge foundry market is heating up. For example, GlobalFoundries, Intel, Samsung and TSMC have recently announced their new and respective processes. The new processes from vendors range...
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New BEOL/MOL Breakthroughs?
Chipmakers are moving ahead with transistor scaling at advanced nodes, but it’s becoming more difficult. The industry is struggling to maintain the same timeline for contacts and interconnects, which...
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Shrink Or Package?
Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around...
View ArticleStart Your HBM/2.5D Design Today
High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first...
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A Learning Machine For Machine Learning
Artificial intelligence and machine learning are hot. Many, many startups, exciting new applications and lots of venture money. The technology promises to change the world. Whether it’s autonomous...
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Challenges For Future Fan-Outs
The fan-out wafer-level packaging market is heating up. At the high end, for example, several packaging houses are developing new fan-out packages that could reach a new milestone and hit or break the...
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Advanced Packaging Picks Up Steam
The semiconductor industry’s push toward continued miniaturization and increasing complexity is driving wider adoption of system-in-package (SiP) technology. One of the big benefits of SiP is that it...
View ArticleRe-Using IP In Packaging
For the past decade, the promise held forth by advanced packaging was that it would allow chipmakers to mix and match analog and digital IP without worrying about the process node at which they were...
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What Does An IoT Chip Look Like?
By Ed Sperling and Jeff Dorsch Internet of Things chip design sounds like a simple topic on the face of it. Look deeper, though, and it becomes clear there is no single IoT, and certainly no type of...
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Is 7nm The Last Major Node?
A growing number of design and manufacturing issues are prompting questions about what scaling will really look like beyond 10/7nm, how many companies will be involved, and which markets they will...
View ArticleSolving The Design And Verification Challenges Of High Density Advanced...
This paper discusses ways in which design teams can apply silicon (IC) type processes to the design and verification of the emerging HDAP packages. High Density Advanced Packaging, or HDAP, is the...
View ArticlePackaging Enters New Phase
The race is on to make advanced packaging less expensive than shrinking everything down onto the same die—much less expensive, in fact. Following several years of speculation and rather shaky market...
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Is Design Innovation Slowing?
Paul Teich, principal analyst for Tirias Research, gave a provocative talk at the recent DAC conference entitled, “Is Integration Leaving Less Room for Design Innovation?” The answer isn’t as simple as...
View ArticleIP Biz Changes As Markets Fragment
Semiconductor Engineering sat down to discuss IP protection, tracking and reuse with Srinath Anantharaman, CEO of ClioSoft; Jeff Galloway, CTO of Silicon Creations; Marc Greenberg, group director of...
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Executive Insight: Lip-Bu Tan
Semiconductor Engineering sat down with Lip-Bu Tan, president and CEO of Cadence, to discuss disruptions and changes in the semiconductor industry, from machine learning and advance packaging to tools...
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Get Ready For In-Mold Electronics
Imagine inserting the electronics into a product without using a printed circuit board, a module, or even a system-in-package. That’s the promise of in-mold electronics (IME), a technology that has...
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Multi-Physics Combats Commoditization
The semiconductor industry has benefited greatly from developments around digital circuitry. Circuits have grown in size from a few logic gates in the 1980s to well over 1 billion today. In comparison,...
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Light In A Package
Silicon photonics is gaining significant traction inside the data center, but creating a simpler method of packaging the laser with other circuitry remains a stumbling block for cutting costs and using...
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Plugging Gaps In Advanced Packaging
The growing difficulty of cramming more features into an SoC is driving the entire chip industry to consider new packaging options, whether that is a more complex, integrated SoC or some type of...
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